Scaling AI Infrastructure
XPU / Ethernet / Optics / SerDes / DSP / PCIe
Open // Scalable // Power Efficient
Broadcom returns to the Optical Fiber Communications Conference and Exhibition (OFC) in Los Angeles to unveil the latest advancements in our AI Infrastructure portfolio. This year, we are spotlighting solutions across XPU, Ethernet, Optics, SerDes, DSP, and PCIe technologies. Beyond our booth, Broadcom experts will be featured in technical speaking sessions and participate in joint technology demos with industry partners -- all showcasing how Broadcom technology is Scaling AI Infrastructure.
News
Press Releases
Blogs
Videos
Leader Insights
Sessions
OFC Speakers
| Topic / Talk Title | Speaker | Type | Time |
|---|---|---|---|
| Chasing the Limit: On the Path to Photonic Scale-Up with Ultra-Low-Energy/Bit | I-Hsing Tan, Ph.D. Director, Product Marketing, OSD | Workshop | Sun 15 March @ 13:00 - 15:30 Room 515B |
| Panel: Scale Out Data Center Networks | Near Margalit VP & GM, OSD | Panel | Mon 16 March @ 10:30 - 12:00 Optica Executive Forum @ JW Marriott |
| OFC N2 Subcommittee: Optics and Photonics for Data Center and Computing Applications Session Title: Photonic Interconnects for Scalable AI | Anand Ramaswamy Solutions Architect, OSD | Presentation | Mon 16 March Session: 16:30 - 18:30 Presentation: 17:45 -18:15 |
| Technology Showcase: Data Center Reliability in Crisis: Why Past Validations Breaks at 1.6T | Cathy Liu Distinguished Engineer, SerDes Architect, PLP | Panel | Tues 17 March @ 11:45 - 12:15 Expo Theater III |
| Market Status and Enabling Technologies of 1.6 Tbps and Beyond | Rajiv Pancholy Director of Hyperscale Strategy & Products, OSD | Workshop | Tues 17 March @ 12:30 Expo Theater I |
| Scaling AI Clusters: Challenges in Scale-Up and Scale-Out for Future Growth | Anand Ramaswamy Solutions Architect | Panel | Tues 17 March @ 14:15 - 15:45 Expo Theater II |
| OIF CEI - 448Gbps – Fast and Furious Signaling Spec Development | Cathy Liu Distinguished Engineer, SerDes Architect, PLP | Presentation | Tues 17 March @ 16:00 - 17:00 Expo Theater III |
| Symposium: Next Generation Interconnects for AI scale up Systems | Manish Mehta VP of Product Marketing & Operations, OSD | Invited Talk | Tues 17 March Session: 16:30 - 18:30 Presentation: 17:00 - 17:15 Room 515A |
| Session Title: High-Speed EAMs and EMLs Paper Title: 400G per lane Differential Drive Electroabsorption Modulated Lasers (EML) with 99GHz 6-dB EO BW for next generation 3.2T IM-DD Applications | Prashanth Bhasker Principal R&D Engineer, OSD | Technical Paper | Tues 17 March Session: 16:30 - 18:30 Presentation: 18:00 - 18:15 |
| Hyperlight Presents TFLN Photonics at the Inflection Point: Product Readiness, Manufacturing Scaling, Packaging and Deployment | Vasudevan Parthasarathy Technical Director, PLP | Panel | Wed 18 Mar @ 11:30 - 12:30 Expo Theater III |
| GSA Presents Bridging Silicon and Light: Innovations at the Intersection of Semiconductors and Photonics | Near Margalit VP & GM, OSD | Panel | Wed 18 Mar @ 12:45 - 13:45 Expo Theater III |
| OIF - Driving Optical Interconnects Specs for AI | Cathy Liu Distinguished Engineer, SerDes Architect, PLP | Presentation | Thurs 19 Mar @ 13:30-14:30 Expo Theater II |
| Is CPO Integration Ready for AI Pipelines? | Matt Traverso Distinguished Engineer, OSD | Workshop | Sun 15 March @ 16:00 - 18:30 Room 515B |
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