Broadcom is excited to attend SC26 this year, November 15-20, in Chicago. We are also honored to have been selected by the SC26 committee to participate in the popular Workshop Program, and will be conducting a workshop entitled:
aI and HPC Fabrics
High Performance Fabrics for AI and HPC
AI models continue to grow to trillions of parameters and exascale HPC simulations are becoming a reality. As computing demands surge for AI and HPC applications, networking becomes essential for performance and scaling. This workshop focuses on bringing together industry experts and researchers to address networking challenges in building high-performance AI and HPC fabrics.
ORganizers
Organizers
| Name | Description |
| Dr. Hemal Sha | Distinguished Engineer and Architect, Broadcom Inc. |
| Dr. Mohan Kalkunte | VP of Architecture, Broadcom Inc. |
| Dr. Dhabaleswar K (DK) Panda | Professor and University Distinguished Scholar of Computer Science and Engineering, Ohio State University |
| Manoj Wadekar | AI Systems Technologist, Meta |
Goals
Workshop Goals
The workshop will bring together perspectives from academic researchers, hyperscale operators, and industry ecosystem partners. The following are the key goals of this workshop:
- Explore novel research ideas around AI/HPC fabrics and related areas
- Serve as a key venue for sharing research ideas, experiences, and best practices in building high performance AI/HPC fabrics
- Offer collaboration opportunities to academic researchers, industry technologists, and students to work together to address challenges in designing large scale high-performance fabric solutions for AI/HPC workloads
- Provide a venue for participants to present early ideas and obtain feedback
- Provide attendees with a holistic understanding of Ethernet’s technical maturity, open challenges, and opportunities for research, standardization, and community collaboration
Relevance and impact
Relevance and Impact to SC Attendees:
The SC Conference is a premier venue for discussing AI/HPC technologies, and with the increasing scale of networking into HPC/AI environments, this workshop is highly relevant. SC attendees, including academic researchers, students, and industry professionals, will benefit from:
- Collaboration opportunities with leaders in high-performance AI/HPC networking
- Insights into cutting-edge networking infrastructure technologies for AI/HPC workloads
- Opportunities to engage with researchers in the field and learn new ideas
- A better understanding of deployment challenges with large-scale AI/HPC networks
Topics for the Workshop:
- AI/HPC fabric architecture
- Telemetry and diagnostics for AI/HPC fabrics
- Systems software for AI/HPC fabrics
- AI/HPC application networking patterns
- Switching and routing technologies for AI/HPC fabrics
- Congestion control in AI/HPC Networks
- Scale-out, Scale-Up, and Scale-across Ethernet Solutions for AI/HPC
- Ethernet transport enhancements
- Ethernet Fabric load balancing techniques
- Protocol and interfaces for AI/ML communications
- High-performance host-network interface architectures
- Software for monitoring, controlling, and managing Ethernet networks
We invite you to submit papers (up to 12 pages) describing a novel research contribution in the topics listed above to be presented at the workshop.
Timeline
Timeline
| Name | Date |
| Call for Papers: | May 15, 2026 |
| Paper submissions due: | August 15, 2026 |
| Notification to authors of acceptance: | September 5, 2026 |
| Camera ready papers due: | September 29, 2026 |
| Workshop takes place: | November 2026 |
| For Questions or to Submit Papers Now, Email Us At: sc26-wksp137-cfp.pdl@broadcom.com |
