SC26

SC26 Call for Papers for the First Workshop on:

High Performance Fabrics for AI and HPC

High Performance Fabrics for AI and HPC

AI models continue to grow to trillions of parameters and exascale HPC simulations are becoming a reality. As computing demands surge for AI and HPC applications, networking becomes essential for performance and scaling. This workshop focuses on bringing together industry experts and researchers to address networking challenges in building high-performance AI and HPC fabrics.

General Chairs

NameTitle
Dr. Hemal ShahDistinguished Engineer and Architect, Broadcom Inc.
Manoj WadekarAI Systems Technologist, Meta

Organizers

NameTitle
Dr. Hemal ShahDistinguished Engineer and Architect, Broadcom Inc.
Dr. Mohan KalkunteVP of Architecture, Broadcom Inc.
Dr. Dhabaleswar K (DK) PandaProfessor and University Distinguished Scholar of Computer Science and Engineering, Ohio State University
Manoj WadekarAI Systems Technologist, Meta

Workshop Goals

The workshop will bring together perspectives from academic researchers, hyperscale operators, and industry ecosystem partners. The following are the key goals of this workshop:

  1. Explore novel research ideas around AI/HPC fabrics and related areas
  2. Serve as a key venue for sharing research ideas, experiences, and best practices in building high performance AI/HPC fabrics 
  3. Offer collaboration opportunities to academic researchers, industry technologists, and students to work together to address challenges in designing large scale high-performance fabric solutions for AI/HPC workloads
  4. Provide a venue for participants to present early ideas and obtain feedback
  5. Provide attendees with a holistic understanding of Ethernet’s technical maturity, open challenges, and opportunities for research, standardization, and community collaboration

Relevance and Impact to SC Attendees:

The SC Conference is a premier venue for discussing AI/HPC technologies, and with the increasing scale of networking into HPC/AI environments, this workshop is highly relevant. SC attendees, including academic researchers, students, and industry professionals, will benefit from:

  • Collaboration opportunities with leaders in high-performance AI/HPC networking
  • Insights into cutting-edge networking infrastructure technologies for AI/HPC workloads
  • Opportunities to engage with researchers in the field and learn new ideas
  • A better understanding of deployment challenges with large-scale AI/HPC networks

Topics for the Workshop:

  1. AI/HPC fabric architecture
  2. Telemetry and diagnostics for AI/HPC fabrics
  3. Systems software for AI/HPC fabrics
  4. AI/HPC application networking patterns
  5. Switching and routing technologies for AI/HPC fabrics
  6. Congestion control in AI/HPC Networks
  7. Scale-out, Scale-Up, and Scale-across Ethernet Solutions for AI/HPC
  8. Ethernet transport enhancements
  9. Ethernet Fabric load balancing techniques
  10. Protocol and interfaces for AI/ML communications
  11. High-performance host-network interface architectures
  12. Software for monitoring, controlling, and managing Ethernet networks

Paper Submission:

Please submit papers on original work, work-in-progress, or position papers. The submissions should be between 6 and 10 two-column pages (U.S. letter - 8.5" x 11"), excluding the bibliography, using the ACM proceedings template. The ACM conference proceeding templates for LaTeX and MS Word are provided by ACM for download here: https://www.acm.org/publications/proceedings-template. Paper should be submitted via Linklings at https://submissions.supercomputing.org/. Please choose the TBD Workshop under the SC26 Workshops header.

Timeline

NameDate
Call for Papers:May 15, 2026
Paper submissions due:August 15, 2026
Notification to authors of acceptance:September 5, 2026
Camera ready papers due:September 29, 2026
Workshop takes place:November 2026

Program Committee

NameTitle
Pavan BalajiMeta
Daniele De SensiSapienza University of Rome
Albert GreenburgUber
Mark HandleyUniversity of College London (Pending)
Torsten HoeflerETH Zurich
Hugh HolbrookArista
Abdul KabbaniMicrosoft
Adnan KhaleelGoogle Inc.
Balaji PrabhakarStanford University
Muhammad ShahbazUniversity of Michigan
Sameer ShendeUniversity of Oregon
Rip SohanAMD
Hari SubramoniThe Ohio State University
Rajeev ThakurArgonne National Lab (Pending)
Brian TowlesOpenAI

For Questions or to Submit Papers Now, Email Us At:
sc26-wksp137-cfp.pdl@broadcom.com